

//  PCB IGES v8.9_1.2 (EN2001.1.2) Thu Jul 25 12:17:21 EDT 2002
//  IGES Version 5.2
//
//  Copyright (c) Mentor Graphics Corporation, 1982-1993, All Rights Reserved.
//                       UNPUBLISHED, LICENSED SOFTWARE.
//            CONFIDENTIAL AND PROPRIETARY INFORMATION WHICH IS THE
//          PROPERTY OF MENTOR GRAPHICS CORPORATION OR ITS LICENSORS.
//
//  Mentor Graphics software executing under INTEL MS Windows NT.
// 
                                        
                      Today's Date Tue Jul 05 10:03:02 2005
                                        
                                        
                              Translation Log File
                                        

                      List of Configuration Parameters Used
                      -------------------------------------
                                        

  MODE                "OUTPUT"
  LOG_FILE            "f:/Projects/BC08_HW_CS_029000/pcb/pcb_iges_log"
  MESSAGE             "BOTH"
  PCB_LAYERS          "f:/Projects/BC08_HW_CS_029000/pcb/layers.layers_2291"
  PCB_ATTRIBUTES      "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file"
  PCB_COLORS          "C:/MentorGraphics/MGC_HOME/pkgs/pcb_iges/data/color_map.pcb"
  DESIGN              ""
  ASCII_GEOMS         "f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms"
  IGES_FILE           "f:/Projects/BC08_HW_CS_029000/pcb/BC08_HW_CS_029000.igs"
  FILE_MODE           "REPLACE"
  LAYER_MAP           "C:/MentorGraphics/MGC_HOME/pkgs/pcb_iges/data/iges_layers"
  SUPRESS_WARN        "FALSE"
  OUTPUT_MODE         "PICTURE"
  SENDING_PID         ""
  RECEIVING_PID       ""
  AUTHOR              ""
  ORGANIZATION        ""
  GEOMETRY_NAME       "BC08_HW_CS_029000"
  TRACE_STYLE         "CLINE"
  TECHNOLOGY          "f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874"
  DRILL_TABLE         ""
  PINS                ""
  OUTPUT_UNITS        "MILLIMETER"
  LAYER_LIST          "BOARD_OUTLINE", "SOLDER_MASK_2", "SILKSCREEN_2" 
 
 

                      PCB Design Database Parsing Summary
                       ----------------------------------

 Parsing the PCB design database....

 Parsing PCB Colors file C:/MentorGraphics/MGC_HOME/pkgs/pcb_iges/data/color_map.pcb....

 Parsing PCB Layers file f:/Projects/BC08_HW_CS_029000/pcb/layers.layers_2291....

 Parsing PCB Attributes file C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file....

 Parsing Ascii Geoms file f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms....

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12010".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 950.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12012".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 951.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12010".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 2067.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12012".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 2068.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12013".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 2069.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12010".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 13108.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12012".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 13109.

*** Warning (BSP_M18) ***
 Attribute does not exist in attribute file.
 Entity not processed.
 Attribute file - "C:/MentorGraphics/MGC_HOME/pkgs/pcb_base/data/attribute_file".
 Attribute name - "12013".
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Line - 13110.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22099.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22101.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22103.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22105.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22108.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22110.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22112.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22114.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22116.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22118.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22120.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22122.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22124.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22126.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22128.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22130.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22132.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22134.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22136.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22138.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22140.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22142.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22144.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22146.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22148.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22150.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22153.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22154.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22155.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22156.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22157.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22158.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22159.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22568.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22569.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22570.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22571.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22572.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22573.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22574.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22575.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22576.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22577.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22578.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22579.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22580.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22581.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22582.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22626.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22628.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22630.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22632.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22634.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22636.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22638.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22640.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22642.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22644.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22646.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22648.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22650.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22652.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22654.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22657.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22658.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22659.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22660.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22661.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22662.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22663.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22664.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22665.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22666.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22667.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22668.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22669.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22670.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Function - $$VIEW_LAYERS.
 Record Number - 22671.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22702.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22704.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22706.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22708.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22710.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22712.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22714.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22716.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22718.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22720.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22722.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22724.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22726.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22728.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22730.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22732.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22734.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22736.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22738.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22740.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22742.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22744.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22746.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22748.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22750.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22752.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22754.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/ascii_geoms.
 Record Type - $$TEMPLATE_DIMENSION.
 Record Number - 22756.

 Parsing Technology file f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874....

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SET_ENDCODE.
 Record Number - 11.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 28.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 29.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 30.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 31.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 32.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 33.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_MATERIAL.
 Record Number - 34.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_NET_RULES.
 Record Number - 57.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 58.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 59.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 60.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 61.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 62.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 63.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_NET_RULES.
 Record Number - 64.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 65.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 66.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 67.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 68.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 69.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 70.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_NET_RULES.
 Record Number - 71.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 72.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 73.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_NET_RULES.
 Record Number - 74.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 75.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 76.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 77.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 78.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 79.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 80.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_NET_RULES.
 Record Number - 81.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 82.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 83.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 84.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 85.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 86.

*** Warning (BSP_M6) ***
 Invalid syntax encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Record Type - $$DEFINE_LAYER_NET_RULES.
 Record Number - 87.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_TOPOLOGY_SPECIFICATION_IN_ELEC_CLASS.
 Record Number - 103.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_LENGTH_MULTIPLIER_OF_LAYER_IN_ELEC_CLASS.
 Record Number - 104.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_LENGTH_MULTIPLIER_OF_LAYER_IN_ELEC_CLASS.
 Record Number - 105.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_LENGTH_MULTIPLIER_OF_LAYER_IN_ELEC_CLASS.
 Record Number - 106.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_LENGTH_MULTIPLIER_OF_LAYER_IN_ELEC_CLASS.
 Record Number - 107.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_LENGTH_MULTIPLIER_OF_LAYER_IN_ELEC_CLASS.
 Record Number - 108.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$DEFINE_LENGTH_MULTIPLIER_OF_LAYER_IN_ELEC_CLASS.
 Record Number - 109.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_TESTPOINT_RULES.
 Record Number - 121.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_TESTPOINT_OVERRIDE_RULES.
 Record Number - 122.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_PROBE_CLEARANCE_OVERRIDES.
 Record Number - 123.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_DEFAULT_TESTPOINT_REQUIREMENTS.
 Record Number - 124.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_TESTPOINT_CANDIDATE_PRIORITIES.
 Record Number - 125.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_TESTPOINT_CANDIDATE_MODES.
 Record Number - 126.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_SYMBOL_PIN_PRIORITY.
 Record Number - 127.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$SETUP_VIA_PRIORITY.
 Record Number - 128.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_TYPE.
 Record Number - 134.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_TYPE.
 Record Number - 135.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_TYPE.
 Record Number - 136.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_LAYER.
 Record Number - 140.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_LAYER.
 Record Number - 141.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_LAYER.
 Record Number - 142.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_LAYER.
 Record Number - 143.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_LAYER.
 Record Number - 144.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_LAYER.
 Record Number - 145.

*** Information (BSP_M7) ***
 Unsupported function call encountered while parsing.
 File - f:/Projects/BC08_HW_CS_029000/pcb/tech.tech_2874.
 Function - $$MICROVIA_SET_RULES.
 Record Number - 149.

                                        
                     *** Summary of PCB Entities Parsed ***
 
 Count     Type      Form      Description
 -----     ----      ----      -----------

   249       10         0      Define Attribute  
   175       10         1      Define Layer  
   100       10         2      Define Color  
   416      100         0      Arc  
   266      101         0      Circle  
  1684      102         0      Path  
   800      103         0      Polygon  
   278      104         0      Text  
    33      105         0      Add  
   379      106         0      Create Part  
    69      107         0      Dimension  
   379      108         0      Page  
  1758      200      2222      Component Pin Defintion  
     1      200      2226      Board Placement Keepout  
    31      200      2227      Routing Keepout  
    88      200      2228      Component Placement Outline  
     1      200      2229      Board Routing Outline  
     1      200      2230      Board Placement Outline  
   176      200      2240      Drill Definition Unplated  
     1      200      2245      Drill Origin  
     1      200      2246      Milling Origin  
     1      200     10000      Board Definition Identifier  
     1      200     10100      Artwork Definition Identifier  
     1      200     10110      Panel Definition Identifier  
     1      200     10200      Board Routing Layers  
     1      200     10202      Default Pad Size  
     1      200     10205      Board Placement Grid  
     1      200     10206      Board Placement Clearance  
     1      200     10210      Power Net Names  
     1      200     10221      Board Default Padstack  
     1      200     10231      Board Thickness  
     1      200     10232      Board Material  
     1      200     10233      Board Internal Copper  
     1      200     10234      Board External Copper  
    16      200     10401      Terminal Thruhole Definition  
   238      200     10402      Terminal Surface Definition  
     3      200     10413      Terminal Buried Via Definition  
     1      200     10601      Diagonal Routing Allowed  
     1      200     10604      Tjunctions Allowed  
    19      200     10421      Terminal Drill Size  
    88      200     10702      Component Layout Surface  
    75      200     10703      Component Layout Type  
    44      200     10704      Component Diagonal Allowed  
     2      200     10705      Component Orthogonal Only  
     1      200     10707      Required Component Rotation  
    84      200     10708      Component Outline Overhang  
    80      200     10709      Component Height  
    72      200     10711      Component Default Padstack  
  1560      200     10712      Component Padstack Override  
     6      200     10730      Component Not In BOM  
     6      200     10751      Component Specific Layer On  
     2      200     10752      Component Specific Layer Off  
     1      200     10901      Artwork 01 Layer Definition  
     1      200     10902      Artwork 02 Layer Definition  
     1      200     10903      Artwork 03 Layer Definition  
     1      200     10904      Artwork 04 Layer Definition  
     1      200     10905      Artwork 05 Layer Definition  
     1      200     10906      Artwork 06 Layer Definition  
     1      200     10907      Artwork 07 Layer Definition  
     1      200     10908      Artwork 08 Layer Definition  
     1      200     10909      Artwork 09 Layer Definition  
     1      200     10910      Artwork 10 Layer Definition  
     1      200     10911      Artwork 11 Layer Definition  
    11      200       999      User Defined Attribute  
     1      300         0      Lock Windows  
   421      301         0      Point Mode  
   289      302         0      Internal Name  
     4      400         1      Template Layer  
     7      400         3      Template Padwidtth  
   114      400         7      Template Line Style  
     1      450         0      Define Technology  
     1      450         1      Define Rule Board  
     6      450         2      Define Physical Layer  
     3      450         4      Define Rule Via  
     2      450         5      Define Rule Noconnect  
     2      450         6      Define Rule Underpad  
     6      450         9      Define Layer Rules  
 
 -----     -------------------------------
 10076     Total Entity Count

 Finished parsing the PCB design database.

 
 
 

                           PCB Output Translation Summary
                    ----------------------------------------

 Translating the PCB entities....

 (     3) IGES Entities created - Next status at (    50) entities.

 (    50) IGES Entities created - Next status at (   100) entities.

 (   100) IGES Entities created - Next status at (   500) entities.

 Finished translating the PCB entities.

 
 
 

                     PCB General Output Translation Messages
               -------------------------------------------------

 Not all of the PCB Text Fonts are mapped.
 The following table defines the mapping used for this translation.

           PCB Font         IGES Font
      ------------------    ---------

       std                  1 - Default ASCII
       iso                  19 - OCR-B (IS1073)
       iso88591-m           19 - OCR-B (IS1073)
       iso88591-p           19 - OCR-B (IS1073)
       leroy                2 - LeRoy
       iges1003             1003 - Drafting
       microfilm            1 - Default ASCII
       mil-std              1 - Default ASCII
       All Others           1 - Default ASCII

 
 
 

                          IGES File Formatting Summary
                          ----------------------------

 Start Section:
 
 
 Global Section:
 
 Parameter Delimiter:      ,
 Record Delimiter:         ;
 Sending Product ID:       
 File Name:                f:/Projects/BC08_HW_CS_029000/pcb/BC08_HW_CS_029000.igs
 System ID:                MGCv8.9_1.2
 Preprocessor Version:     v8.9_1.2 (EN2001.1.2) Thu Jul 25 12:17:21 EDT 2002
 Size of Integer:          32
 Sgl. Precision Mag:       38
 Sgl. Precision Sig:       6
 Dbl. Precision Mag:       308
 Dbl. Precision Sig:       15
 Receiving Product ID:     
 Model Space Scale:        1.000000e+000
 Unit Flag:                2
 Unit String:              MM
 # of Line Weights:        32767
 Maximum Line Width:       2.540000e+001
 Creation Date:            07/05/05 10:03:02
 Minimum Resolution:       2.540000e-005
 Maximum Coordinate:       0.000000e+000
 Author:                   
 Organization:             
 IGES Version Number:      10
 Drafting Standard:        0
 Model Create/Modify Date: 07/05/05 10:03:02

 Formatting the IGES file....

                                        
                   *** Summary of IGES Entities Formatted ***
 
 Count     Type      Form      Description
 -----     ----      ----      -----------

     2      100         0      Circular Arc  
    57      106        11      Planar Piecewise Linear Curve  
    23      106        63      Simple Closed Planar Curve  
     8      212         6      General Note (Left justified)  
   100      314         0      Color Definition  
 
 -----     -------------------------------
   190     Total Entity Count

 Finished formatting the IGES file.

 
 
 

                            Elapsed Time:  00:00:05

